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Microelectronic packaging

概要

作品:	4 作品在 4 項出版品 4 種語言

書目資訊

Multichip modules:systems advantages,major constructions,andmaterials technologies by: (書目-語言資料,印刷品)

Flip chip technologies by: (書目-語言資料,印刷品)

MEMS/MOEMS packaging: concepts, designs, materials, and processes by: (書目-語言資料,印刷品)

Advanced electronic packaging by: (書目-語言資料,印刷品)

主題

Electronic packaging

Microelectronic packaging

Microelectronic packaging

Microelectronics-Design and...

Multichip modules...

Microelectronic packaging

Optoelectronic devices

Microelectromechanical systems

Microelectronic packaging

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