大葉大學圖書館 |

Overview

Works:	4 works in 4 publications in 4 languages

Titles

Multichip modules:systems advantages,major constructions,andmaterials technologies by: (Language materials, printed)

Flip chip technologies by: (Language materials, printed)

MEMS/MOEMS packaging: concepts, designs, materials, and processes by: (Language materials, printed)

Advanced electronic packaging by: (Language materials, printed)

Subjects