言語
Liu, Yong.
概観
| 著作: | 1 作品に 2 出版物中に 1 言語 | |
|---|---|---|
タイトル
Power electronic packaging[electronic resource] :design, assembly process, reliability and modeling /
…で:
Liu, Yong.; SpringerLink (Online service)
(言語・文字資料 (印刷物))
Wafer-level chip-scale packaging[electronic resource] :analog and power semiconductor applications /
…で:
Liu, Yong.; Qu, Shichun.; SpringerLink (Online service)
(言語・文字資料 (印刷物))
主題
Solid State Physics.
Electronics and Microelectronics, Instrumentation.
Spectroscopy and Microscopy.
Power Electronics, Electrical Machines and Networks.
Circuits and Systems.
Electronic packaging.
Power electronics.
Chip scale packaging.
Engineering.
Engineering Thermodynamics, Heat and Mass Transfer.