Languages
Liu, Yong.
Overview
| Works: | 1 works in 2 publications in 1 languages | |
|---|---|---|
Titles
Power electronic packaging[electronic resource] :design, assembly process, reliability and modeling /
by:
Liu, Yong.; SpringerLink (Online service)
(Language materials, printed)
Wafer-level chip-scale packaging[electronic resource] :analog and power semiconductor applications /
by:
Liu, Yong.; Qu, Shichun.; SpringerLink (Online service)
(Language materials, printed)
Subjects
Solid State Physics.
Electronics and Microelectronics, Instrumentation.
Spectroscopy and Microscopy.
Power Electronics, Electrical Machines and Networks.
Circuits and Systems.
Electronic packaging.
Power electronics.
Chip scale packaging.
Engineering.
Engineering Thermodynamics, Heat and Mass Transfer.