语系
Liu, Yong.
概要
| 作品: | 1 作品在 2 项出版品 1 种语言 | |
|---|---|---|
书目信息
Power electronic packaging[electronic resource] :design, assembly process, reliability and modeling /
by:
Liu, Yong.; SpringerLink (Online service)
(书目-语言数据,印刷品)
Wafer-level chip-scale packaging[electronic resource] :analog and power semiconductor applications /
by:
Liu, Yong.; Qu, Shichun.; SpringerLink (Online service)
(书目-语言数据,印刷品)
主题
Solid State Physics.
Electronics and Microelectronics, Instrumentation.
Spectroscopy and Microscopy.
Power Electronics, Electrical Machines and Networks.
Circuits and Systems.
Electronic packaging.
Power electronics.
Chip scale packaging.
Engineering.
Engineering Thermodynamics, Heat and Mass Transfer.