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Handbook of silicon based MEMS materials and technologies[electronic resource] /

纪录类型:	书目-电子资源 : Monograph/item
[NT 15000414] null:	621.3815/2
[NT 47271] Title/Author:	Handbook of silicon based MEMS materials and technologies/ edited by Markku Tilli ... [et al.]
[NT 51406] other author:	Tilli, Markku.
出版者:	London, UK : : William Andrew,, 2015.
面页册数:	1 online resource : : ill.
标题:	Microelectromechanical systems.
标题:	Microelectromechanical systems - Materials.
标题:	Silicon - Electric properties.
ISBN:	9780323312233 (electronic bk.)
ISBN:	0323312233 (electronic bk.)
ISBN:	9780323299657 (electronic bk.)
[NT 15000227] null:	Includes bibliographical references and index.
[NT 15000229] null:	The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
电子资源:	click for full text

Handbook of silicon based MEMS materials and technologies[electronic resource] /
Handbook of silicon based MEMS materials and technologies[electronic resource] /edited by Markku Tilli ... [et al.] - 2nd ed. - London, UK :William Andrew,2015. - 1 online resource :ill. - Micro & nano technologies. - Micro & nano technologies..

Includes bibliographical references and index.

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.

ISBN: 9780323312233 (electronic bk.)Subjects--Topical Terms:

343612
Microelectromechanical systems.
Index Terms--Genre/Form:

336502
Electronic books.

LC Class. No.: TK7875

Dewey Class. No.: 621.3815/2

Handbook of silicon based MEMS materials and technologies[electronic resource] /
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520 $a The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
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650 0 $a Silicon $x Electric properties. $3 444273
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700 1 $a Tilli, Markku. $3 658961
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