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Handbook of silicon based MEMS mater...

Tilli, Markku.

Handbook of silicon based MEMS materials and technologies[electronic resource] /

紀錄類型:	書目-電子資源 : Monograph/item
杜威分類號:	621.3815/2
書名/作者:	Handbook of silicon based MEMS materials and technologies/ edited by Markku Tilli ... [et al.]
其他作者:	Tilli, Markku.
出版者:	London, UK : : William Andrew,, 2015.
面頁冊數:	1 online resource : : ill.
標題:	Microelectromechanical systems.
標題:	Microelectromechanical systems - Materials.
標題:	Silicon - Electric properties.
ISBN:	9780323312233 (electronic bk.)
ISBN:	0323312233 (electronic bk.)
ISBN:	9780323299657 (electronic bk.)
書目註:	Includes bibliographical references and index.
摘要、提要註:	The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
電子資源:	click for full text

Handbook of silicon based MEMS materials and technologies[electronic resource] /
Handbook of silicon based MEMS materials and technologies[electronic resource] /edited by Markku Tilli ... [et al.] - 2nd ed. - London, UK :William Andrew,2015. - 1 online resource :ill. - Micro & nano technologies. - Micro & nano technologies..

Includes bibliographical references and index.

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.

ISBN: 9780323312233 (electronic bk.)Subjects--Topical Terms:

343612
Microelectromechanical systems.
Index Terms--Genre/Form:

336502
Electronic books.

LC Class. No.: TK7875

Dewey Class. No.: 621.3815/2

Handbook of silicon based MEMS materials and technologies[electronic resource] /
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245 0 0 $a Handbook of silicon based MEMS materials and technologies $h [electronic resource] / $c edited by Markku Tilli ... [et al.]
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520 $a The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
650 0 $a Microelectromechanical systems. $3 343612
650 0 $a Microelectromechanical systems $x Materials. $3 444272
650 0 $a Silicon $x Electric properties. $3 444273
655 4 $a Electronic books. $2 local $3 336502
700 1 $a Tilli, Markku. $3 658961
830 0 $a Micro & nano technologies. $3 405091
856 4 0 $u http://www.sciencedirect.com/science/book/9780323299657 $z click for full text

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