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Development of infrared techniques for practical defect identification in bonded joints[electronic resource] /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
杜威分類號:
620.1127
書名/作者:
Development of infrared techniques for practical defect identification in bonded joints/ by Rachael C. Waugh.
作者:
Waugh, Rachael C.
出版者:
Cham : : Springer International Publishing :, 2016.
面頁冊數:
xxviii, 149 p. : : ill., digital ;; 24 cm.
Contained By:
Springer eBooks
標題:
Infrared testing.
標題:
Nondestructive testing.
標題:
Materials Science.
標題:
Characterization and Evaluation of Materials.
標題:
Quality Control, Reliability, Safety and Risk.
標題:
Surface and Interface Science, Thin Films.
ISBN:
9783319229829
ISBN:
9783319229812
內容註:
Introduction -- Adhesive bonding -- Non-destructive evaluation -- The physics and implementation of thermography -- Preliminary results -- Numerical modelling -- Kissing defects -- Practical application of PT/PPT -- Industrial applications -- Conclusions and future work.
摘要、提要註:
Maximizing reader insights into the use of thermography, specifically pulsed and pulse phase thermography (PT and PPT), for the identification of kissing defects in adhesive bonds, this thesis focuses on the application of PT and PPT for the identification of a range of defect types in a variety of materials to establish the effect of material properties on identification of defects. Featuring analysis of a numerical model developed to simulate the thermal evolution created during a PT or PPT experiment, after validation through a series of case studies, this model is then used as a predictive tool to relate defect detectability to the thermal property contrast between defect and bulk materials. Demonstrating a means of producing realistic kissing defects in bonded joints where insufficient thermal property contrast exists defects have a limited effect on heat propagation through a component and therefore are not detected using PT or PPT, this thesis discusses the addition of a small load to bonds containing kissing defects which was found to open the defects sufficiently to enable their detection. A low cost infrared detector, Flir Tau320, is compared to the research based photon detector, Flir SC5000, and is shown to be suitable for application in PT, thus enabling a significantly lower cost tool to be developed.
電子資源:
http://dx.doi.org/10.1007/978-3-319-22982-9
Development of infrared techniques for practical defect identification in bonded joints[electronic resource] /
Waugh, Rachael C.
Development of infrared techniques for practical defect identification in bonded joints
[electronic resource] /by Rachael C. Waugh. - Cham :Springer International Publishing :2016. - xxviii, 149 p. :ill., digital ;24 cm. - Springer theses,2190-5053. - Springer theses..
Introduction -- Adhesive bonding -- Non-destructive evaluation -- The physics and implementation of thermography -- Preliminary results -- Numerical modelling -- Kissing defects -- Practical application of PT/PPT -- Industrial applications -- Conclusions and future work.
Maximizing reader insights into the use of thermography, specifically pulsed and pulse phase thermography (PT and PPT), for the identification of kissing defects in adhesive bonds, this thesis focuses on the application of PT and PPT for the identification of a range of defect types in a variety of materials to establish the effect of material properties on identification of defects. Featuring analysis of a numerical model developed to simulate the thermal evolution created during a PT or PPT experiment, after validation through a series of case studies, this model is then used as a predictive tool to relate defect detectability to the thermal property contrast between defect and bulk materials. Demonstrating a means of producing realistic kissing defects in bonded joints where insufficient thermal property contrast exists defects have a limited effect on heat propagation through a component and therefore are not detected using PT or PPT, this thesis discusses the addition of a small load to bonds containing kissing defects which was found to open the defects sufficiently to enable their detection. A low cost infrared detector, Flir Tau320, is compared to the research based photon detector, Flir SC5000, and is shown to be suitable for application in PT, thus enabling a significantly lower cost tool to be developed.
ISBN: 9783319229829
Standard No.: 10.1007/978-3-319-22982-9doiSubjects--Topical Terms:
652272
Infrared testing.
LC Class. No.: TA417.5
Dewey Class. No.: 620.1127
Development of infrared techniques for practical defect identification in bonded joints[electronic resource] /
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Introduction -- Adhesive bonding -- Non-destructive evaluation -- The physics and implementation of thermography -- Preliminary results -- Numerical modelling -- Kissing defects -- Practical application of PT/PPT -- Industrial applications -- Conclusions and future work.
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