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Adhesion in microelectronics[electro...

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Ahsan, Tanweer.

Adhesion in microelectronics[electronic resource] /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.381/046
書名/作者:	Adhesion in microelectronics/ edited by K. L. Mittal and Tanweer Ahsan.
其他作者:	Mittal, K. L.,
出版者:	Hoboken, New Jersey : : John Wiley and Sons, Inc.,, 2014.
面頁冊數:	1 online resource.
標題:	Microelectronic packaging - Materials.
標題:	Adhesives.
標題:	Adhesive joints.
ISBN:	9781118831342 (epub)
ISBN:	1118831349 (epub)
ISBN:	9781118831359 (pdf)
ISBN:	1118831357 (pdf)
ISBN:	9781118831373 (electronic bk.)
ISBN:	1118831373
書目註:	Includes bibliographical references and index.
電子資源:	http://onlinelibrary.wiley.com/book/10.1002/9781118831373

Adhesion in microelectronics[electronic resource] /
Adhesion in microelectronics[electronic resource] /edited by K. L. Mittal and Tanweer Ahsan. - Hoboken, New Jersey :John Wiley and Sons, Inc.,2014. - 1 online resource.

Includes bibliographical references and index.

ISBN: 9781118831342 (epub)

LCCN: 2014031115Subjects--Topical Terms:

624408
Microelectronic packaging
--Materials.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381/046

Adhesion in microelectronics[electronic resource] /
LDR:01112cam a2200313 i 4500 001 437652
003 OCoLC
005 20151014105515.0
006 m o d
007 cr |||||||||||
008 160125s2014 nju ob 001 0 eng
010 $a 2014031115
020 $a 9781118831342 (epub)
020 $a 1118831349 (epub)
020 $a 9781118831359 (pdf)
020 $a 1118831357 (pdf)
020 $z 9781118831335 (cloth : alk. paper)
020 $a 9781118831373 (electronic bk.)
020 $a 1118831373
035 $a (OCoLC)885378211
035 $a ocn885378211
040 $a DLC $b eng $c DLC $d EBLCP $d N $d YDXCP $d DG1 $d E7B $d VRC $d OCLCF $d RECBK $d OCLCO $d DEBSZ
050 0 0 $a TK7870.15
082 0 0 $a 621.381/046 $2 23
245 0 0 $a Adhesion in microelectronics $h [electronic resource] / $c edited by K. L. Mittal and Tanweer Ahsan.
260 $a Hoboken, New Jersey : $b John Wiley and Sons, Inc., $c 2014.
300 $a 1 online resource.
504 $a Includes bibliographical references and index.
588 $a Description based on print version record and CIP data provided by publisher.
650 0 $a Microelectronic packaging $x Materials. $3 624408
650 0 $a Adhesives. $3 195865
650 0 $a Adhesive joints. $3 550104
700 1 $a Mittal, K. L., $d 1945- $3 343634
700 1 $a Ahsan, Tanweer. $3 624407
856 4 0 $u http://onlinelibrary.wiley.com/book/10.1002/9781118831373

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