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Adhesives technology for electronic applications[electronic resource] :materials, processing, reliability /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	668/.3
書名/作者:	Adhesives technology for electronic applications : materials, processing, reliability // James J. Licari and Dale W. Swanson.
作者:	Licari, James J.,
其他作者:	Swanson, Dale W.
出版者:	Amsterdam ; : Elsevier,, c2011.
面頁冊數:	1 online resource (x, 403 p.)
標題:	Electronics - Materials.
標題:	Adhesives.
ISBN:	9781437778892 (electronic bk.)
ISBN:	1437778895 (electronic bk.)
內容註:	Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors.
摘要、提要註:	Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: . Tamper-proof adhesives for electronic security devices. . Bio-compatible adhesives for implantable medical devices. . Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). . Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications - this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals. Provides specifications of adhesives for particular uses and outlines the processes for application and curing - coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device. Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel.
電子資源:	http://www.sciencedirect.com/science/book/9781437778892

Adhesives technology for electronic applications[electronic resource] :materials, processing, reliability /
Licari, James J.,1930-

Adhesives technology for electronic applicationsmaterials, processing, reliability /[electronic resource] :James J. Licari and Dale W. Swanson. - 2nd ed. - Amsterdam ;Elsevier,c2011. - 1 online resource (x, 403 p.) - Materials and Processes for Electronic Applications.

Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors.

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: . Tamper-proof adhesives for electronic security devices. . Bio-compatible adhesives for implantable medical devices. . Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). . Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications - this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals. Provides specifications of adhesives for particular uses and outlines the processes for application and curing - coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device. Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel.

ISBN: 9781437778892 (electronic bk.)Subjects--Topical Terms:

336602
Electronics
--Materials.Index Terms--Genre/Form:

336502
Electronic books.

LC Class. No.: TK7871 / .L53 2011eb

Dewey Class. No.: 668/.3

Adhesives technology for electronic applications[electronic resource] :materials, processing, reliability /
LDR:03781cam 2200337Ka 4500 001 370708
005 20120813074125.0
006 m d
007 cr cn|||||||||
008 121228s2011 ne o 000 0 eng d
019 $a 697774643
020 $a 9781437778892 (electronic bk.)
020 $a 1437778895 (electronic bk.)
029 1 $a AU@ $b 000047656103
035 $a ocn733936687
040 $a OPELS $b eng $c OPELS $d OCLCQ $d E7B $d YDXCP $d BWX $d OCLCQ $d CDX $d TEF
049 $a NTYA
050 4 $a TK7871 $b .L53 2011eb
082 0 4 $a 668/.3 $2 23
100 1 $a Licari, James J., $d 1930- $3 486570
245 1 0 $a Adhesives technology for electronic applications $h [electronic resource] : $b materials, processing, reliability / $c James J. Licari and Dale W. Swanson.
250 $a 2nd ed.
260 $a Amsterdam ; $a Boston : $b Elsevier, $c c2011.
300 $a 1 online resource (x, 403 p.)
490 0 $a Materials and Processes for Electronic Applications
505 0 $a Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors.
520 $a Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: . Tamper-proof adhesives for electronic security devices. . Bio-compatible adhesives for implantable medical devices. . Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). . Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications - this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals. Provides specifications of adhesives for particular uses and outlines the processes for application and curing - coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device. Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel.
588 $a Description based on print version record.
650 0 $a Electronics $x Materials. $3 336602
650 0 $a Adhesives. $3 195865
655 4 $a Electronic books. $2 local $3 336502
700 1 $a Swanson, Dale W. $3 486571
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9781437778892
938 $a ebrary $b EBRY $n ebr10480746
938 $a YBP Library Services $b YANK $n 3595968
938 $a Blackwell Book Service $b BBUS $n 3595968
938 $a Coutts Information Services $b COUT $n 18140542