大葉大學圖書館 |

登入

回首頁

Thermal design :heat sinks, thermoel...

Lee, Ho Sung.

Thermal design :heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.402/5
書名/作者:	Thermal design : : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells // HoSung Lee.
作者:	Lee, Ho Sung.
出版者:	Hoboken, NJ : : Wiley,, c2010.
面頁冊數:	xviii, 630 p. : : ill. ;; 25 cm.
標題:	Heat engineering - Materials.
標題:	Heat-transfer media.
標題:	Thermodynamics.
標題:	Thermoelectric apparatus and appliances.
ISBN:	9780470496626 (hbk.) :
書目註:	Includes bibliographical references and index.
摘要、提要註:	"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"--

Thermal design :heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells /
Lee, Ho Sung.

Thermal design :heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells /HoSung Lee. - Hoboken, NJ :Wiley,c2010. - xviii, 630 p. :ill. ;25 cm.

Includes bibliographical references and index.

"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"--

ISBN: 9780470496626 (hbk.) :NTD 4,799

LCCN: 2010018381Subjects--Topical Terms:

684321
Heat engineering
--Materials.

LC Class. No.: TJ255.5 / .L44 2010

Dewey Class. No.: 621.402/5

Thermal design :heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells /
LDR:02322cam a2200253 a 4500 001 474558
005 20130213155833.0
008 180625s2010 njua b 001 0 eng
010 $a 2010018381
020 $a 9780470496626 (hbk.) : $c NTD 4,799
020 $z 9780470949979 (ebk.)
020 $z 9780470951606 (ebk.)
020 $z 9780470951774 (ebk.)
020 $z 9781118004685 (ebk.)
020 $z 9781118004708 (ebk.)
020 $z 9781118004715 (ebk.)
040 $a DLC $c DLC $d DLC $d DYU
041 0 $a eng
050 0 0 $a TJ255.5 $b .L44 2010
082 0 0 $a 621.402/5 $2 22
100 1 $a Lee, Ho Sung. $3 684320
245 1 0 $a Thermal design : $b heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells / $c HoSung Lee.
260 $a Hoboken, NJ : $b Wiley, $c c2010.
300 $a xviii, 630 p. : $b ill. ; $c 25 cm.
504 $a Includes bibliographical references and index.
520 $a "The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"-- $c Provided by publisher.
650 0 $a Heat engineering $x Materials. $3 684321
650 0 $a Heat-transfer media. $3 684322
650 0 $a Thermodynamics. $3 172172
650 0 $a Thermoelectric apparatus and appliances. $3 609141