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Three-dimensional integration of semiconductors[electronic resource] :processing, materials, and applications /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.38152
書名/作者:	Three-dimensional integration of semiconductors : processing, materials, and applications // edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
其他作者:	Kondo, Kazuo.
出版者:	Cham : : Springer International Publishing :, 2015.
面頁冊數:	xix, 408 p. : : ill., digital ;; 24 cm.
Contained By:	Springer eBooks
標題:	Semiconductors.
標題:	Semiconductors - Materials.
標題:	Chemistry.
標題:	Electrochemistry.
標題:	Electrical Engineering.
標題:	Mechanical Engineering.
標題:	Biomedical Engineering.
ISBN:	9783319186757
ISBN:	9783319186740
內容註:	Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
摘要、提要註:	This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
電子資源:	http://dx.doi.org/10.1007/978-3-319-18675-7

Three-dimensional integration of semiconductors[electronic resource] :processing, materials, and applications /
Three-dimensional integration of semiconductorsprocessing, materials, and applications /[electronic resource] :edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. - Cham :Springer International Publishing :2015. - xix, 408 p. :ill., digital ;24 cm.

Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

ISBN: 9783319186757

Standard No.: 10.1007/978-3-319-18675-7doiSubjects--Topical Terms:

175080
Semiconductors.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.38152

Three-dimensional integration of semiconductors[electronic resource] :processing, materials, and applications /
LDR:01995nam a2200313 a 4500 001 444526
003 DE-He213
005 20160516160049.0
006 m d
007 cr nn 008maaau
008 160715s2015 gw s 0 eng d
020 $a 9783319186757 $q (electronic bk.)
020 $a 9783319186740 $q (paper)
024 7 $a 10.1007/978-3-319-18675-7 $2 doi
035 $a 978-3-319-18675-7
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874.893
072 7 $a PNRH $2 bicssc
072 7 $a SCI013050 $2 bisacsh
082 0 4 $a 621.38152 $2 23
090 $a TK7874.893 $b .T531 2015
245 0 0 $a Three-dimensional integration of semiconductors $h [electronic resource] : $b processing, materials, and applications / $c edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a xix, 408 p. : $b ill., digital ; $c 24 cm.
505 0 $a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
520 $a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
650 0 $a Semiconductors. $3 175080
650 0 $a Semiconductors $x Materials. $3 336564
650 1 4 $a Chemistry. $3 182539
650 2 4 $a Electrochemistry. $3 416584
650 2 4 $a Electrical Engineering. $3 463968
650 2 4 $a Mechanical Engineering. $3 463878
650 2 4 $a Biomedical Engineering. $3 382389
700 1 $a Kondo, Kazuo. $3 612864
700 1 $a Kada, Morihiro. $3 636131
700 1 $a Takahashi, Kenji. $3 636132
710 2 $a SpringerLink (Online service) $3 463450
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-18675-7
950 $a Chemistry and Materials Science (Springer-11644)