Carbon nanotube based VLSI interconn...
Kaushik, Brajesh Kumar.

 

  • Carbon nanotube based VLSI interconnects[electronic resource] :analysis and design /
  • 紀錄類型: 書目-語言資料,印刷品 : Monograph/item
    杜威分類號: 621.395
    書名/作者: Carbon nanotube based VLSI interconnects : analysis and design // by Brajesh Kumar Kaushik, Manoj Kumar Majumder.
    作者: Kaushik, Brajesh Kumar.
    其他作者: Majumder, Manoj Kumar.
    出版者: New Delhi : : Springer India :, 2015.
    面頁冊數: xi, 86 p. : : ill., digital ;; 24 cm.
    Contained By: Springer eBooks
    標題: Interconnects (Integrated circuit technology)
    標題: Integrated circuits - Very large scale integration
    標題: Carbon nanotubes.
    標題: Engineering.
    標題: Nanotechnology and Microengineering.
    標題: Circuits and Systems.
    標題: Optical and Electronic Materials.
    ISBN: 9788132220473 (electronic bk.)
    ISBN: 9788132220466 (paper)
    內容註: Interconnects -- Carbon Nanotube -- Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References.
    摘要、提要註: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
    電子資源: http://dx.doi.org/10.1007/978-81-322-2047-3
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