大葉大學圖書館 |

Packaging of high power semiconductor lasers[electronic resource] /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.366
書名/作者:	Packaging of high power semiconductor lasers/ by Xingsheng Liu ... [et al.].
其他作者:	Liu, Xingsheng.
出版者:	New York, NY : : Springer New York :, 2015.
面頁冊數:	xv, 402 p. : : ill., digital ;; 24 cm.
Contained By:	Springer eBooks
標題:	Semiconductor lasers.
標題:	Electronic packaging.
標題:	Energy.
標題:	Energy Systems.
ISBN:	9781461492634 (electronic bk.)
ISBN:	9781461492627 (paper)
內容註:	Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
摘要、提要註:	This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
電子資源:	http://dx.doi.org/10.1007/978-1-4614-9263-4

Packaging of high power semiconductor lasers[electronic resource] /
Packaging of high power semiconductor lasers[electronic resource] /by Xingsheng Liu ... [et al.]. - New York, NY :Springer New York :2015. - xv, 402 p. :ill., digital ;24 cm. - Micro- and opto-electronic materials, structures, and systems. - Micro- and opto-electronic materials, structures, and systems..

Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

ISBN: 9781461492634 (electronic bk.)

Standard No.: 10.1007/978-1-4614-9263-4doiSubjects--Topical Terms:

174684
Semiconductor lasers.

LC Class. No.: QC689.55.S45

Dewey Class. No.: 621.366

Packaging of high power semiconductor lasers[electronic resource] /
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505 0 $a Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
520 $a This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
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