語系
Liu, Yong.
概要
| 作品: | 1 作品在 2 項出版品 1 種語言 | |
|---|---|---|
書目資訊
Power electronic packaging[electronic resource] :design, assembly process, reliability and modeling /
by:
Liu, Yong.; SpringerLink (Online service)
(書目-語言資料,印刷品)
Wafer-level chip-scale packaging[electronic resource] :analog and power semiconductor applications /
by:
Liu, Yong.; Qu, Shichun.; SpringerLink (Online service)
(書目-語言資料,印刷品)
主題
Solid State Physics.
Electronics and Microelectronics, Instrumentation.
Spectroscopy and Microscopy.
Power Electronics, Electrical Machines and Networks.
Circuits and Systems.
Electronic packaging.
Power electronics.
Chip scale packaging.
Engineering.
Engineering Thermodynamics, Heat and Mass Transfer.