大葉大學圖書館 |

Thermal transport in oblique finned micro/minichannels[electronic resource] /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.4022
書名/作者:	Thermal transport in oblique finned micro/minichannels/ by Yan Fan ... [et al.].
其他作者:	Fan, Yan.
出版者:	Cham : : Springer International Publishing :, 2015.
面頁冊數:	xiii, 130 p. : : ill., digital ;; 24 cm.
Contained By:	Springer eBooks
標題:	Heat - Transmission.
標題:	Heat sinks (Electronics)
標題:	Engineering.
標題:	Engineering Thermodynamics, Heat and Mass Transfer.
標題:	Engineering Fluid Dynamics.
標題:	Electronics and Microelectronics, Instrumentation.
標題:	Energy Systems.
標題:	Machinery and Machine Elements.
ISBN:	9783319096476 (electronic bk.)
ISBN:	9783319096469 (paper)
內容註:	Introduction -- Planar Oblique Fin Microchannel Heat Sink -- Cylindrical Oblique Fin Minichannel Heat Sink -- Thermal Management and Application for Oblique Fins -- Conclusions -- Appendix -- References.
摘要、提要註:	The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.
電子資源:	http://dx.doi.org/10.1007/978-3-319-09647-6

Thermal transport in oblique finned micro/minichannels[electronic resource] /
Thermal transport in oblique finned micro/minichannels[electronic resource] /by Yan Fan ... [et al.]. - Cham :Springer International Publishing :2015. - xiii, 130 p. :ill., digital ;24 cm. - SpringerBriefs in applied sciences and technology, Thermal engineering and applied science,2191-530X. - SpringerBriefs in applied sciences and technology.Thermal engineering and applied science..

Introduction -- Planar Oblique Fin Microchannel Heat Sink -- Cylindrical Oblique Fin Minichannel Heat Sink -- Thermal Management and Application for Oblique Fins -- Conclusions -- Appendix -- References.

The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.

ISBN: 9783319096476 (electronic bk.)

Standard No.: 10.1007/978-3-319-09647-6doiSubjects--Topical Terms:

382398
Heat
--Transmission.

LC Class. No.: TJ260

Dewey Class. No.: 621.4022

Thermal transport in oblique finned micro/minichannels[electronic resource] /
LDR:02266nam a2200325 a 4500 001 424941
003 DE-He213
005 20150617110323.0
006 m d
007 cr nn 008maaau
008 151119s2015 gw s 0 eng d
020 $a 9783319096476 (electronic bk.)
020 $a 9783319096469 (paper)
024 7 $a 10.1007/978-3-319-09647-6 $2 doi
035 $a 978-3-319-09647-6
040 $a GP $c GP
041 0 $a eng
050 4 $a TJ260
072 7 $a TGMB $2 bicssc
072 7 $a SCI065000 $2 bisacsh
082 0 4 $a 621.4022 $2 23
090 $a TJ260 $b .T411 2015
245 0 0 $a Thermal transport in oblique finned micro/minichannels $h [electronic resource] / $c by Yan Fan ... [et al.].
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a xiii, 130 p. : $b ill., digital ; $c 24 cm.
490 1 $a SpringerBriefs in applied sciences and technology, Thermal engineering and applied science, $x 2191-530X
505 0 $a Introduction -- Planar Oblique Fin Microchannel Heat Sink -- Cylindrical Oblique Fin Minichannel Heat Sink -- Thermal Management and Application for Oblique Fins -- Conclusions -- Appendix -- References.
520 $a The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.
650 0 $a Heat $x Transmission. $3 382398
650 0 $a Heat sinks (Electronics) $3 603302
650 1 4 $a Engineering. $3 372756
650 2 4 $a Engineering Thermodynamics, Heat and Mass Transfer. $3 463870
650 2 4 $a Engineering Fluid Dynamics. $3 464271
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 463474
650 2 4 $a Energy Systems. $3 464757
650 2 4 $a Machinery and Machine Elements. $3 463954
700 1 $a Fan, Yan. $3 603300
710 2 $a SpringerLink (Online service) $3 463450
773 0 $t Springer eBooks
830 0 $a SpringerBriefs in applied sciences and technology. $p Thermal engineering and applied science. $3 603301
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-09647-6
950 $a Engineering (Springer-11647)