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Advances in CMP/polishing technologi...

Doi, Toshiro.

Advances in CMP/polishing technologies for the manufacture of electronic devices[electronic resource] /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	671.7/2
書名/作者:	Advances in CMP/polishing technologies for the manufacture of electronic devices/ edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
其他作者:	Doi, Toshiro.
出版者:	Oxford : : William Andrew,, 2012.
面頁冊數:	1 online resource (xii, 317 p.)
附註:	Includes index.
標題:	Electrolytic polishing.
標題:	Grinding and polishing.
ISBN:	9781437778595
ISBN:	1437778593
摘要、提要註:	CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
電子資源:	http://www.sciencedirect.com/science/book/9781437778595

Advances in CMP/polishing technologies for the manufacture of electronic devices[electronic resource] /
Advances in CMP/polishing technologies for the manufacture of electronic devices[electronic resource] /edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa. - 1st ed. - Oxford :William Andrew,2012. - 1 online resource (xii, 317 p.)

Includes index.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.

ISBN: 9781437778595Subjects--Topical Terms:

486588
Electrolytic polishing.
Index Terms--Genre/Form:

336502
Electronic books.

LC Class. No.: TS670 / .A386 2012eb

Dewey Class. No.: 671.7/2

Advances in CMP/polishing technologies for the manufacture of electronic devices[electronic resource] /
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245 0 0 $a Advances in CMP/polishing technologies for the manufacture of electronic devices $h [electronic resource] / $c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
250 $a 1st ed.
260 $a Oxford : $b William Andrew, $c 2012.
300 $a 1 online resource (xii, 317 p.)
500 $a Includes index.
520 $a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
650 0 $a Electrolytic polishing. $3 486588
650 0 $a Grinding and polishing. $3 418222
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700 1 $a Doi, Toshiro. $4 edt $3 486585
700 1 $a Marinescu, Ioan D. $4 edt $3 486586
700 1 $a Kurokawa, Syuhei. $4 edt $3 486587
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