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Lead free solder[electronic resource...
~
Pang, John Hock Lye.
Lead free solder[electronic resource] :mechanics and reliability /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
杜威分類號:
671.52
書名/作者:
Lead free solder : mechanics and reliability // by John Hock Lye Pang.
作者:
Pang, John Hock Lye.
出版者:
New York, NY : : Springer Science+Business Media, LLC,, 2012.
面頁冊數:
x, 175 p. : : ill., digital ;; 24 cm.
Contained By:
Springer eBooks
標題:
Circuits and Systems.
標題:
Solder and soldering.
標題:
Lead-free electronics manufacturing processes.
標題:
Green electronics.
標題:
Engineering.
標題:
Electronics and Microelectronics, Instrumentation.
標題:
Optical and Electronic Materials.
標題:
Continuum Mechanics and Mechanics of Materials.
ISBN:
9781461404637 (electronic bk.)
ISBN:
9781461404620 (paper)
電子資源:
http://dx.doi.org/10.1007/978-1-4614-0463-7
Lead free solder[electronic resource] :mechanics and reliability /
Pang, John Hock Lye.
Lead free solder
mechanics and reliability /[electronic resource] :by John Hock Lye Pang. - New York, NY :Springer Science+Business Media, LLC,2012. - x, 175 p. :ill., digital ;24 cm.
ISBN: 9781461404637 (electronic bk.)Subjects--Topical Terms:
463473
Circuits and Systems.
LC Class. No.: TS610 / .P36 2012
Dewey Class. No.: 671.52
Lead free solder[electronic resource] :mechanics and reliability /
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