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Three-dimensional integrated circuit...

Friedman, Eby G.

Three-dimensional integrated circuit design[electronic resource] /

レコード種別:	言語・文字資料 (印刷物) : 単行資料
[NT 15000414] null:	621.3815
タイトル / 著者:	Three-dimensional integrated circuit design/ Vasilis F. Pavlidis, Eby G. Friedman.
著者:	Pavlidis, Vasilis F.,
その他の著者:	Friedman, Eby G.
出版された:	Amsterdam ; : Morgan Kaufmann,, c2009.
記述:	xv, 309 p. : : ill. ;; 25 cm.
シリーズ:	The Morgan Kaufmann series in systems on silicon
主題:	Integrated circuits - Design and construction.
国際標準図書番号 (ISBN) :	9780123743435
国際標準図書番号 (ISBN) :	0123743435
[NT 15000227] null:	Includes bibliographical references (p. 289-303) and index.
[NT 15000228] null:	Chapter 1. Introduction -- Chapter 2. Manufacturing of 3-D Packaged Systems -- Chapter 3. 3-D Integrated Circuit Fabrication Technologies -- Chapter 4. Interconnect Prediction Models -- Chapter 5. Physical Design Techniques for 3-D ICs -- Chapter 6. Thermal Management Techniques -- Chapter 7. Timing Optimization for Two-Terminal Interconnects -- Chapter 8. Timing Optimization for Multi-Terminal Interconnects -- Appendix A: Enumeration of Gate Pairs in a 3-D IC --Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-Terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets -- References.
[NT 15000229] null:	With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
電子資源:	An electronic book accessible through the World Wide Web; click for information
電子資源:	An electronic book accessible through the World Wide Web; click for information

Three-dimensional integrated circuit design[electronic resource] /
Pavlidis, Vasilis F.,1976-

Three-dimensional integrated circuit design[electronic resource] /Vasilis F. Pavlidis, Eby G. Friedman. - Amsterdam ;Morgan Kaufmann,c2009. - xv, 309 p. :ill. ;25 cm. - The Morgan Kaufmann series in systems on silicon.

Includes bibliographical references (p. 289-303) and index.

Chapter 1. Introduction -- Chapter 2. Manufacturing of 3-D Packaged Systems -- Chapter 3. 3-D Integrated Circuit Fabrication Technologies -- Chapter 4. Interconnect Prediction Models -- Chapter 5. Physical Design Techniques for 3-D ICs -- Chapter 6. Thermal Management Techniques -- Chapter 7. Timing Optimization for Two-Terminal Interconnects -- Chapter 8. Timing Optimization for Multi-Terminal Interconnects -- Appendix A: Enumeration of Gate Pairs in a 3-D IC --Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-Terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets -- References.

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.

Electronic reproduction.
Amsterdam :
Elsevier Science & Technology,
2009.

Mode of access: World Wide Web.

ISBN: 9780123743435

Source: 152801:152956Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

343137
Integrated circuits
--Design and construction.Index Terms--Genre/Form:

336502
Electronic books.

LC Class. No.: TK7874 / .P39 2009

Dewey Class. No.: 621.3815

Three-dimensional integrated circuit design[electronic resource] /
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020 $a 0123743435
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035 $a (OCoLC)318353703
035 $a ocn318353703
037 $a 152801:152956 $b Elsevier Science & Technology $n http://www.sciencedirect.com
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100 1 $a Pavlidis, Vasilis F., $d 1976- $3 405579
245 1 0 $a Three-dimensional integrated circuit design $h [electronic resource] / $c Vasilis F. Pavlidis, Eby G. Friedman.
260 $a Amsterdam ; $a Boston : $b Morgan Kaufmann, $c c2009.
300 $a xv, 309 p. : $b ill. ; $c 25 cm.
440 4 $a The Morgan Kaufmann series in systems on silicon
504 $a Includes bibliographical references (p. 289-303) and index.
505 0 $a Chapter 1. Introduction -- Chapter 2. Manufacturing of 3-D Packaged Systems -- Chapter 3. 3-D Integrated Circuit Fabrication Technologies -- Chapter 4. Interconnect Prediction Models -- Chapter 5. Physical Design Techniques for 3-D ICs -- Chapter 6. Thermal Management Techniques -- Chapter 7. Timing Optimization for Two-Terminal Interconnects -- Chapter 8. Timing Optimization for Multi-Terminal Interconnects -- Appendix A: Enumeration of Gate Pairs in a 3-D IC --Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-Terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets -- References.
520 $a With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
533 $a Electronic reproduction. $b Amsterdam : $c Elsevier Science & Technology, $d 2009. $n Mode of access: World Wide Web. $n System requirements: Web browser. $n Title from title screen (viewed on Apr. 10, 2009). $n Access may be restricted to users at subscribing institutions.
650 0 $a Integrated circuits $x Design and construction. $3 343137
655 7 $a Electronic books. $2 local $3 336502
700 1 $a Friedman, Eby G. $3 405580
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776 1 $c Original $z 9780123743435 $z 0123743435 $w (OCoLC)228364680
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780123743435 $z An electronic book accessible through the World Wide Web; click for information
856 4 0 $3 Referex $u http://www.engineeringvillage.com/controller/servlet/OpenURL?genre=book&isbn=9780123743435 $z An electronic book accessible through the World Wide Web; click for information
994 $a C0 $b TEF

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http://www.sciencedirect.com/science/book/9780123743435
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