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[NT 60476] Jump To :
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书目信息
主题
Three-dimensional integrated circuits - Design and construction.
概要
作品:
2 作品在 2 项出版品 2 种语言
书目信息
Electrical design of through silicon via[electronic resource] /
by:
(书目-语言数据,印刷品)
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs[electronic resource] /
by:
(书目-语言数据,印刷品)
主题
Special Purpose and Application-Based Systems.
Circuits and Systems.
Three-dimensional integrated circuits
Engineering.
Electronic Circuits and Devices.
Semiconductors.
Processor Architectures.
Circuits and Systems.
Three-dimensional integrated circuits
Engineering.
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