大葉大學圖書館 |

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces[electronic resource] /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.381
書名/作者:	Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces/ by Qingke Zhang.
作者:	Zhang, Qingke.
出版者:	Berlin, Heidelberg : : Springer Berlin Heidelberg :, 2016.
面頁冊數:	xv, 143 p. : : ill., digital ;; 24 cm.
Contained By:	Springer eBooks
標題:	Lead-free electronics manufacturing processes - Research.
標題:	Solder and soldering - Design and construction.
標題:	Electronics - Materials.
標題:	Engineering.
標題:	Structural Mechanics.
標題:	Surfaces and Interfaces, Thin Films.
標題:	Mechanics.
標題:	Characterization and Evaluation of Materials.
ISBN:	9783662488232
ISBN:	9783662488218
內容註:	Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.
摘要、提要註:	This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
電子資源:	http://dx.doi.org/10.1007/978-3-662-48823-2

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces[electronic resource] /
Zhang, Qingke.

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces[electronic resource] /by Qingke Zhang. - Berlin, Heidelberg :Springer Berlin Heidelberg :2016. - xv, 143 p. :ill., digital ;24 cm. - Springer theses,2190-5053. - Springer theses..

Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

ISBN: 9783662488232

Standard No.: 10.1007/978-3-662-48823-2doiSubjects--Topical Terms:

653007
Lead-free electronics manufacturing processes
--Research.

LC Class. No.: TK7836

Dewey Class. No.: 621.381

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces[electronic resource] /
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