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3D stacked chips[electronic resource] :from emerging processes to heterogeneous systems /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.395
書名/作者:	3D stacked chips : from emerging processes to heterogeneous systems // edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis.
其他作者:	Elfadel, Ibrahim M.
出版者:	Cham : : Springer International Publishing :, 2016.
面頁冊數:	xxiii, 339 p. : : ill. (some col.), digital ;; 24 cm.
Contained By:	Springer eBooks
標題:	Three-dimensional integrated circuits.
標題:	Engineering.
標題:	Circuits and Systems.
標題:	Electronic Circuits and Devices.
標題:	Processor Architectures.
ISBN:	9783319204819
ISBN:	9783319204802
內容註:	Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.
電子資源:	http://dx.doi.org/10.1007/978-3-319-20481-9

3D stacked chips[electronic resource] :from emerging processes to heterogeneous systems /
3D stacked chipsfrom emerging processes to heterogeneous systems /[electronic resource] :edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis. - Cham :Springer International Publishing :2016. - xxiii, 339 p. :ill. (some col.), digital ;24 cm.

Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.

ISBN: 9783319204819

Standard No.: 10.1007/978-3-319-20481-9doiSubjects--Topical Terms:

609314
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.395

3D stacked chips[electronic resource] :from emerging processes to heterogeneous systems /
LDR:02040nam a2200301 a 4500 001 450605
003 DE-He213
005 20161019085925.0
006 m d
007 cr nn 008maaau
008 161210s2016 gw s 0 eng d
020 $a 9783319204819 $q (electronic bk.)
020 $a 9783319204802 $q (paper)
024 7 $a 10.1007/978-3-319-20481-9 $2 doi
035 $a 978-3-319-20481-9
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874.893
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 621.395 $2 23
090 $a TK7874.893 $b .T531 2016
245 0 0 $a 3D stacked chips $h [electronic resource] : $b from emerging processes to heterogeneous systems / $c edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2016.
300 $a xxiii, 339 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.
650 0 $a Three-dimensional integrated circuits. $3 609314
650 1 4 $a Engineering. $3 372756
650 2 4 $a Circuits and Systems. $3 463473
650 2 4 $a Electronic Circuits and Devices. $3 463910
650 2 4 $a Processor Architectures. $3 463933
700 1 $a Elfadel, Ibrahim M. $q (Abe) $3 646904
700 1 $a Fettweis, Gerhard. $3 646905
710 2 $a SpringerLink (Online service) $3 463450
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-20481-9
950 $a Engineering (Springer-11647)