大葉大學圖書館 |

登入

回首頁

Three-dimensional integrated circuit...

Friedman, Eby G.

Three-dimensional integrated circuit design[electronic resource] /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
杜威分類號:	621.3815
書名/作者:	Three-dimensional integrated circuit design/ Vasilis F. Pavlidis, Eby G. Friedman.
作者:	Pavlidis, Vasilis F.,
其他作者:	Friedman, Eby G.
出版者:	Amsterdam ; : Morgan Kaufmann,, c2009.
面頁冊數:	xv, 309 p. : : ill. ;; 25 cm.
叢書名:	The Morgan Kaufmann series in systems on silicon
標題:	Integrated circuits - Design and construction.
ISBN:	9780123743435
ISBN:	0123743435
書目註:	Includes bibliographical references (p. 289-303) and index.
內容註:	Chapter 1. Introduction -- Chapter 2. Manufacturing of 3-D Packaged Systems -- Chapter 3. 3-D Integrated Circuit Fabrication Technologies -- Chapter 4. Interconnect Prediction Models -- Chapter 5. Physical Design Techniques for 3-D ICs -- Chapter 6. Thermal Management Techniques -- Chapter 7. Timing Optimization for Two-Terminal Interconnects -- Chapter 8. Timing Optimization for Multi-Terminal Interconnects -- Appendix A: Enumeration of Gate Pairs in a 3-D IC --Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-Terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets -- References.
摘要、提要註:	With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
電子資源:	An electronic book accessible through the World Wide Web; click for information
電子資源:	An electronic book accessible through the World Wide Web; click for information

Three-dimensional integrated circuit design[electronic resource] /
Pavlidis, Vasilis F.,1976-

Three-dimensional integrated circuit design[electronic resource] /Vasilis F. Pavlidis, Eby G. Friedman. - Amsterdam ;Morgan Kaufmann,c2009. - xv, 309 p. :ill. ;25 cm. - The Morgan Kaufmann series in systems on silicon.

Includes bibliographical references (p. 289-303) and index.

Chapter 1. Introduction -- Chapter 2. Manufacturing of 3-D Packaged Systems -- Chapter 3. 3-D Integrated Circuit Fabrication Technologies -- Chapter 4. Interconnect Prediction Models -- Chapter 5. Physical Design Techniques for 3-D ICs -- Chapter 6. Thermal Management Techniques -- Chapter 7. Timing Optimization for Two-Terminal Interconnects -- Chapter 8. Timing Optimization for Multi-Terminal Interconnects -- Appendix A: Enumeration of Gate Pairs in a 3-D IC --Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-Terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets -- References.

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.

Electronic reproduction.
Amsterdam :
Elsevier Science & Technology,
2009.

Mode of access: World Wide Web.

ISBN: 9780123743435

Source: 152801:152956Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

343137
Integrated circuits
--Design and construction.Index Terms--Genre/Form:

336502
Electronic books.

LC Class. No.: TK7874 / .P39 2009

Dewey Class. No.: 621.3815

Three-dimensional integrated circuit design[electronic resource] /
LDR:02754cam 2200349Ia 4500 001 338238
003 OCoLC
005 20100729101520.0
006 m d
007 cr cn|||||||||
008 110620s2009 ne a ob 001 0 eng d
020 $a 9780123743435
020 $a 0123743435
029 1 $a NZ1 $b 13078159
035 $a (OCoLC)318353703
035 $a ocn318353703
037 $a 152801:152956 $b Elsevier Science & Technology $n http://www.sciencedirect.com
040 $a OPELS $b eng $c OPELS $d OPELS
049 $a TEFA
050 1 4 $a TK7874 $b .P39 2009
082 0 4 $a 621.3815 $2 22
100 1 $a Pavlidis, Vasilis F., $d 1976- $3 405579
245 1 0 $a Three-dimensional integrated circuit design $h [electronic resource] / $c Vasilis F. Pavlidis, Eby G. Friedman.
260 $a Amsterdam ; $a Boston : $b Morgan Kaufmann, $c c2009.
300 $a xv, 309 p. : $b ill. ; $c 25 cm.
440 4 $a The Morgan Kaufmann series in systems on silicon
504 $a Includes bibliographical references (p. 289-303) and index.
505 0 $a Chapter 1. Introduction -- Chapter 2. Manufacturing of 3-D Packaged Systems -- Chapter 3. 3-D Integrated Circuit Fabrication Technologies -- Chapter 4. Interconnect Prediction Models -- Chapter 5. Physical Design Techniques for 3-D ICs -- Chapter 6. Thermal Management Techniques -- Chapter 7. Timing Optimization for Two-Terminal Interconnects -- Chapter 8. Timing Optimization for Multi-Terminal Interconnects -- Appendix A: Enumeration of Gate Pairs in a 3-D IC --Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-Terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets -- References.
520 $a With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
533 $a Electronic reproduction. $b Amsterdam : $c Elsevier Science & Technology, $d 2009. $n Mode of access: World Wide Web. $n System requirements: Web browser. $n Title from title screen (viewed on Apr. 10, 2009). $n Access may be restricted to users at subscribing institutions.
650 0 $a Integrated circuits $x Design and construction. $3 343137
655 7 $a Electronic books. $2 local $3 336502
700 1 $a Friedman, Eby G. $3 405580
710 2 $a ScienceDirect (Online service) $3 365609
776 1 $c Original $z 9780123743435 $z 0123743435 $w (OCoLC)228364680
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780123743435 $z An electronic book accessible through the World Wide Web; click for information
856 4 0 $3 Referex $u http://www.engineeringvillage.com/controller/servlet/OpenURL?genre=book&isbn=9780123743435 $z An electronic book accessible through the World Wide Web; click for information
994 $a C0 $b TEF

筆 0 讀者評論

多媒體

多媒體檔案
http://www.sciencedirect.com/science/book/9780123743435
http://www.engineeringvillage.com/controller/servlet/OpenURL?genre=book&isbn=9780123743435

評論

新增評論分享你的心得

Export

取書館別