Three-dimensional integrated circuits.
Overview
| Works: | 5 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Design and modeling for 3D ICs and interposers[electronic resource] /
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(Language materials, printed)
3D stacked chips[electronic resource] :from emerging processes to heterogeneous systems /
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(Language materials, printed)
Advances in 3D integrated circuits and systems[electronic resource] /
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(Language materials, printed)
3D integration in VLSI circuits[electronic resource] :implementation technologies and applications /
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(Electronic resources)
Subjects