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概要
书目信息
主题
Three-dimensional integrated circuits.
概要
作品:
5 作品在 1 项出版品 1 种语言
书目信息
Design and modeling for 3D ICs and interposers[electronic resource] /
by:
(书目-语言数据,印刷品)
Vertical 3D memory technologies[electronic resource] /
by:
(书目-语言数据,印刷品)
3D stacked chips[electronic resource] :from emerging processes to heterogeneous systems /
by:
(书目-语言数据,印刷品)
Advances in 3D integrated circuits and systems[electronic resource] /
by:
(书目-语言数据,印刷品)
3D integration in VLSI circuits[electronic resource] :implementation technologies and applications /
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(书目-电子资源)
主题
Three-dimensional integrated circuits.
Three-dimensional integrated circuits.
Semiconductor storage devices.
Processor Architectures.
Circuits and Systems.
Engineering.
Three-dimensional integrated circuits.
Electronic Circuits and Devices.
Three-dimensional integrated circuits.
Integrated circuits
Three-dimensional integrated circuits.
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