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[ subject:"Operating Procedures, Materials Treatment." ]
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Copper wire bonding[electronic resou...
~
Chauhan, Preeti S.
Copper wire bonding[electronic resource] /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
杜威分類號:
621.381046
書名/作者:
Copper wire bonding/ by Preeti S Chauhan ... [et al.].
其他作者:
Chauhan, Preeti S.
出版者:
New York, NY : : Springer New York :, 2014.
面頁冊數:
xxvi, 235 p. : : ill., digital ;; 24 cm.
Contained By:
Springer eBooks
標題:
Wire bonding (Electronic packaging)
標題:
Copper wire.
標題:
Engineering.
標題:
Mechatronics.
標題:
Operating Procedures, Materials Treatment.
標題:
Optical and Electronic Materials.
ISBN:
9781461457619 (electronic bk.)
ISBN:
9781461457602 (paper)
電子資源:
http://dx.doi.org/10.1007/978-1-4614-5761-9
Copper wire bonding[electronic resource] /
Copper wire bonding
[electronic resource] /by Preeti S Chauhan ... [et al.]. - New York, NY :Springer New York :2014. - xxvi, 235 p. :ill., digital ;24 cm.
ISBN: 9781461457619 (electronic bk.)Subjects--Topical Terms:
611150
Wire bonding (Electronic packaging)
Dewey Class. No.: 621.381046
Copper wire bonding[electronic resource] /
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