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[ subject:"Microelectronic packaging" ]
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Adhesion in microelectronics[electro...
~
Ahsan, Tanweer.
Adhesion in microelectronics[electronic resource] /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
杜威分類號:
621.381/046
書名/作者:
Adhesion in microelectronics/ edited by K. L. Mittal and Tanweer Ahsan.
其他作者:
Mittal, K. L.,
出版者:
Hoboken, New Jersey : : John Wiley and Sons, Inc.,, 2014.
面頁冊數:
1 online resource.
標題:
Microelectronic packaging - Materials.
標題:
Adhesives.
標題:
Adhesive joints.
ISBN:
9781118831342 (epub)
ISBN:
1118831349 (epub)
ISBN:
9781118831359 (pdf)
ISBN:
1118831357 (pdf)
ISBN:
9781118831373 (electronic bk.)
ISBN:
1118831373
書目註:
Includes bibliographical references and index.
電子資源:
http://onlinelibrary.wiley.com/book/10.1002/9781118831373
Adhesion in microelectronics[electronic resource] /
Adhesion in microelectronics
[electronic resource] /edited by K. L. Mittal and Tanweer Ahsan. - Hoboken, New Jersey :John Wiley and Sons, Inc.,2014. - 1 online resource.
Includes bibliographical references and index.
ISBN: 9781118831342 (epub)
LCCN: 2014031115Subjects--Topical Terms:
624408
Microelectronic packaging
--Materials.
LC Class. No.: TK7870.15
Dewey Class. No.: 621.381/046
Adhesion in microelectronics[electronic resource] /
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http://onlinelibrary.wiley.com/book/10.1002/9781118831373
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