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Multichip modules:systems advantages...

BaldeJohn W. ed.

Multichip modules:systems advantages,major constructions,andmaterials technologies

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
書名/作者:	Multichip modules:systems advantages,major constructions,andmaterials technologies/ Balde,John W. ed.;Johnson,R.wayne ed.;Teng,Robert K.F. ed.
作者:	BaldeJohn W. ed.
其他作者:	JohnsonR.wayne ed.
出版者:	New York : IEEE Press, 1991
面頁冊數:	603頁; 29x23公分
標題:	Electronic packaging
標題:	Microelectronic packaging
ISBN:	087942267X(精裝)

Multichip modules:systems advantages,major constructions,andmaterials technologies
BaldeJohn W. ed.

Multichip modules:systems advantages,major constructions,andmaterials technologiesBalde,John W. ed.;Johnson,R.wayne ed.;Teng,Robert K.F. ed. - New YorkIEEE Press1991 - 603頁29x23公分 - A VOLUME IN THE IEEE PRESS SELECTED REPRINT SERIES.

ISBN: 087942267X(精裝)Subjects--Topical Terms:

137346
Electronic packaging

Multichip modules:systems advantages,major constructions,andmaterials technologies
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