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Packaging of high power semiconducto...

Liu, Xingsheng.

Packaging of high power semiconductor lasers[electronic resource] /

Record Type:	Language materials, printed : Monograph/item
[NT 15000414]:	621.366
Title/Author:	Packaging of high power semiconductor lasers/ by Xingsheng Liu ... [et al.].
other author:	Liu, Xingsheng.
Published:	New York, NY : : Springer New York :, 2015.
Description:	xv, 402 p. : : ill., digital ;; 24 cm.
Contained By:	Springer eBooks
Subject:	Semiconductor lasers.
Subject:	Electronic packaging.
Subject:	Energy.
Subject:	Energy Systems.
ISBN:	9781461492634 (electronic bk.)
ISBN:	9781461492627 (paper)
[NT 15000228]:	Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
[NT 15000229]:	This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Online resource:	http://dx.doi.org/10.1007/978-1-4614-9263-4

Packaging of high power semiconductor lasers[electronic resource] /
Packaging of high power semiconductor lasers[electronic resource] /by Xingsheng Liu ... [et al.]. - New York, NY :Springer New York :2015. - xv, 402 p. :ill., digital ;24 cm. - Micro- and opto-electronic materials, structures, and systems. - Micro- and opto-electronic materials, structures, and systems..

Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

ISBN: 9781461492634 (electronic bk.)

Standard No.: 10.1007/978-1-4614-9263-4doiSubjects--Topical Terms:

174684
Semiconductor lasers.

LC Class. No.: QC689.55.S45

Dewey Class. No.: 621.366

Packaging of high power semiconductor lasers[electronic resource] /
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020 $a 9781461492634 (electronic bk.)
020 $a 9781461492627 (paper)
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245 0 0 $a Packaging of high power semiconductor lasers $h [electronic resource] / $c by Xingsheng Liu ... [et al.].
260 $a New York, NY : $b Springer New York : $b Imprint: Springer, $c 2015.
300 $a xv, 402 p. : $b ill., digital ; $c 24 cm.
490 1 $a Micro- and opto-electronic materials, structures, and systems
505 0 $a Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
520 $a This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
650 0 $a Semiconductor lasers. $3 174684
650 0 $a Electronic packaging. $3 183876
650 1 4 $a Energy. $3 422946
650 2 4 $a Energy Systems. $3 464757
700 1 $a Liu, Xingsheng. $3 602114
710 2 $a SpringerLink (Online service) $3 463450
773 0 $t Springer eBooks
830 0 $a Micro- and opto-electronic materials, structures, and systems. $3 602115
856 4 0 $u http://dx.doi.org/10.1007/978-1-4614-9263-4
950 $a Engineering (Springer-11647)

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